
(1)基态F原子核外电子有
A.




(2)




(3)


(4)石墨与







(5)芯片制造会经过六个最为关键的步骤:沉积、光刻胶涂覆、光刻、刻蚀、离子注入和封装。其中“刻蚀”过程可能用到刻蚀剂HF、




(6)






同类型试题

y = sin x, x∈R, y∈[–1,1],周期为2π,函数图像以 x = (π/2) + kπ 为对称轴
y = arcsin x, x∈[–1,1], y∈[–π/2,π/2]
sin x = 0 ←→ arcsin x = 0
sin x = 1/2 ←→ arcsin x = π/6
sin x = √2/2 ←→ arcsin x = π/4
sin x = 1 ←→ arcsin x = π/2


y = sin x, x∈R, y∈[–1,1],周期为2π,函数图像以 x = (π/2) + kπ 为对称轴
y = arcsin x, x∈[–1,1], y∈[–π/2,π/2]
sin x = 0 ←→ arcsin x = 0
sin x = 1/2 ←→ arcsin x = π/6
sin x = √2/2 ←→ arcsin x = π/4
sin x = 1 ←→ arcsin x = π/2

