(2)芯片制造过程中的蚀刻要用到氢氟酸(HF),它也能蚀刻玻璃,其中有一个化学反应的化学方程式是:CaSiO3+6HF═X+SiF4↑+3H2O,则X的化学式为

同类型试题

y = sin x, x∈R, y∈[–1,1],周期为2π,函数图像以 x = (π/2) + kπ 为对称轴
y = arcsin x, x∈[–1,1], y∈[–π/2,π/2]
sin x = 0 ←→ arcsin x = 0
sin x = 1/2 ←→ arcsin x = π/6
sin x = √2/2 ←→ arcsin x = π/4
sin x = 1 ←→ arcsin x = π/2


y = sin x, x∈R, y∈[–1,1],周期为2π,函数图像以 x = (π/2) + kπ 为对称轴
y = arcsin x, x∈[–1,1], y∈[–π/2,π/2]
sin x = 0 ←→ arcsin x = 0
sin x = 1/2 ←→ arcsin x = π/6
sin x = √2/2 ←→ arcsin x = π/4
sin x = 1 ←→ arcsin x = π/2

